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Performance：
The coating layer of anode is firm and stable, with high corrosion resistance and long service life
Effectively reduce the voltage, and the energy-saving effect is obvious
Ultra-low electroplating additive consumption, reduce production cost
The u-current density is evenly distributed and has higher through-hole /via filling yield
Scope of application：
VCP/Horizontal line copper plating
Through hole/via filling/pulse copper plating for Flex PCB & PCB
Semiconductor substrate electroplating
Scenarios for application：
